
AutoMATE II
Residual Stress Analyser
- Automated residual stress measurement by X-ray diffraction
- Non-destructive surface and near-surface analysis
- cos²ψ and sin²ψ methods
- Portable and laboratory configurations
- Applications in aerospace, automotive and manufacturing QC
Product Overview
The Rigaku AutoMATE II is an automated residual stress analysis system based on X-ray diffraction. The AutoMATE II provides fast, non-destructive measurement of surface and near-surface residual stresses in metallic and ceramic components, which is critical for predicting component fatigue life, manufacturing quality control and failure analysis.
Residual stress measurement is essential in the aerospace, automotive, power generation, oil and gas, and manufacturing industries where surface treatments such as shot peening, heat treatment, welding and machining introduce stress distributions that affect component performance and reliability. The AutoMATE II’s portable design, automated measurement routines and comprehensive analysis software enable rapid, on-site stress evaluation.
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Technical Specifications
| Type | Residual Stress Analyser |
| Manufacturer | Rigaku |
| Category | Analytical X-Ray |
| Subcategory | Stress Analysers |
| Applications | Research, quality control, production |
| Support | Wirsam Scientific (Southern Africa) |
| Power | Single-phase 230 V / 50–60 Hz |
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