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AutoMATE II
Rigaku

AutoMATE II

Residual Stress Analyser

Residual Stress Analyser — Rigaku
  • Automated residual stress measurement by X-ray diffraction
  • Non-destructive surface and near-surface analysis
  • cos²ψ and sin²ψ methods
  • Portable and laboratory configurations
  • Applications in aerospace, automotive and manufacturing QC


Product Overview

The Rigaku AutoMATE II is an automated residual stress analysis system based on X-ray diffraction. The AutoMATE II provides fast, non-destructive measurement of surface and near-surface residual stresses in metallic and ceramic components, which is critical for predicting component fatigue life, manufacturing quality control and failure analysis.

Residual stress measurement is essential in the aerospace, automotive, power generation, oil and gas, and manufacturing industries where surface treatments such as shot peening, heat treatment, welding and machining introduce stress distributions that affect component performance and reliability. The AutoMATE II’s portable design, automated measurement routines and comprehensive analysis software enable rapid, on-site stress evaluation.

Manufacturer

Rigaku

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Category

Analytical X-Ray

Stress Analysers

Supplier Page

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Technical Specifications

Type Residual Stress Analyser
Manufacturer Rigaku
Category Analytical X-Ray
Subcategory Stress Analysers
Applications Research, quality control, production
Support Wirsam Scientific (Southern Africa)
Power Single-phase 230 V / 50–60 Hz

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