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HomeIndustries › Semiconductor & ElectronicsWafer Analysis | Surface Characterisation | Failure Analysis | Thin Films

Laboratory Solutions for Semiconductor & Electronics

Semiconductor and electronics research laboratories require the most advanced analytical instruments for wafer characterisation, thin film analysis, failure analysis, and device development. Wirsam Scientific supplies leading research-grade instruments for academic and industrial semiconductor programmes.

Wafer InspectionThin Film AnalysisFailure AnalysisSurface MetrologyDevice Development
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Laboratory Solutions for Semiconductor & Electronics

Semiconductor and electronics research laboratories require the most advanced analytical instruments for wafer characterisation, thin film analysis, failure analysis, and device development. Wirsam Scientific supplies TESCAN FIB-SEM and SEM systems, Rigaku NanoHunter II TXRF and SmartLab XRD, CAMECA atom probe and SIMS, Evident wafer inspection microscopes and LEXT confocal profilometers, and Nanosurf AFM systems β€” covering the full spectrum of semiconductor characterisation techniques.

What We Help You Analyse

Wirsam instruments support the full range of analytical requirements in this sector.

πŸ’»Wafer Surface Analysis
πŸ”¬Thin Film Characterisation
⚑Failure Analysis (FIB-SEM)
πŸ“Dimensional Metrology
🧬Device Development
πŸ”­Surface Metrology (AFM)
🌑️Thermal Analysis
πŸ“ŠElemental Depth Profiling
πŸ”©Interconnect Analysis
πŸ›‘οΈReliability Testing

Common Laboratory Challenges

Analytical problems this industry faces and how our instruments address them.

Wafer Surface Contamination

Ultra-trace contaminant detection on semiconductor wafers at sub-ppb levels. TXRF for surface metal contamination monitoring in device fabrication processes.

Thin Film Characterisation

Thickness, composition, and crystallinity of thin films, semiconductor layers, and device structures by XRD, XRF, and electron microscopy. Critical for process development and yield improvement.

Failure Analysis

Root cause analysis of device failures using FIB-SEM cross-sectioning, EDS/EBSD, and TEM sample preparation. Identifying defects, contamination, and structural issues at nanoscale.

Dimensional Metrology

Nanoscale surface topography, roughness, and dimensional measurement by laser confocal microscopy and AFM. Process control for lithography and etch processes.

Customers in Semiconductor & Electronics

πŸ’» Semiconductor ManufacturersπŸ”¬ Research Institutes🏭 Electronics Manufacturers⚑ Failure Analysis Labs🏫 UniversitiesπŸ›‘οΈ Defence & Aerospace

Frequently Asked Questions

For wafer surface contamination, the Rigaku NanoHunter II TXRF provides sub-ppb trace metal detection. For thin film characterisation, the Rigaku SmartLab high-resolution XRD provides epitaxial layer quality, thickness, and composition. For nanoscale surface topography, the Evident LEXT OLS5500 laser confocal microscope provides 10 nm vertical resolution.

We supply TESCAN FIB-SEM systems including the AMBER 2 (gallium FIB-SEM) for precise site-specific sample preparation and TEM lamella preparation. The TESCAN SOLARIS xenon plasma FIB-SEM provides removal rates 50x faster than gallium for large-area milling. Both include integrated EDS and EBSD.

Yes. We supply CAMECA LEAP atom probe tomographs for 3D atomic-scale compositional analysis of semiconductor structures, dopant distributions, and interface chemistry. The LEAP 6000 laser-assisted system is ideal for low-conductivity semiconductor materials.

We provide detailed specifications, pricing, and technical documentation for grant applications. Our team works directly with researchers to ensure instrument specifications meet project requirements and liaises with manufacturers for demonstrations and reference site visits.

Semiconductor Research Instrumentation?

Our specialists work with leading semiconductor research programmes to supply and support advanced analytical instruments across Southern Africa.